JPS5718774Y2 - - Google Patents
Info
- Publication number
- JPS5718774Y2 JPS5718774Y2 JP5374677U JP5374677U JPS5718774Y2 JP S5718774 Y2 JPS5718774 Y2 JP S5718774Y2 JP 5374677 U JP5374677 U JP 5374677U JP 5374677 U JP5374677 U JP 5374677U JP S5718774 Y2 JPS5718774 Y2 JP S5718774Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5374677U JPS5718774Y2 (en]) | 1977-04-26 | 1977-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5374677U JPS5718774Y2 (en]) | 1977-04-26 | 1977-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53147662U JPS53147662U (en]) | 1978-11-20 |
| JPS5718774Y2 true JPS5718774Y2 (en]) | 1982-04-20 |
Family
ID=28947219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5374677U Expired JPS5718774Y2 (en]) | 1977-04-26 | 1977-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5718774Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6048036B2 (ja) * | 1979-07-09 | 1985-10-24 | 株式会社東芝 | 半導体発光表示装置 |
| JPS62210Y2 (en]) * | 1980-06-16 | 1987-01-07 |
-
1977
- 1977-04-26 JP JP5374677U patent/JPS5718774Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53147662U (en]) | 1978-11-20 |